Surface Mount Packages for Electronic Devices
Sensor + Test 2008
16 April 2008
Kyoto / Neuss8 - Kyocera Fineceramics GmbH will present its packaging solutions for electronic devices at the measurement fair "Sensor + Test" in Nuremberg form May 6 to 8, hall 7, booth 7-364.
Among the surface mount packages for electronic devices that Kyocera will introduce at the Sensor + Test fair, the Japanese high technology corporation will concentrate its promotion on the AO700 high strength alumina. This alumina (Al2O3) ceramic material has approximately 1.5 times higher flexural strength (620MPa) than conventional one (per Kyocera material comparison). It is suitable for 2520 size (2.5mm x 2.0mm) or smaller packages. The characteristics of the AO700 material contribute to size reduction of electronic devices such as quartz crystal units and MEMS devices.
Kyocera provides small size surface mount ceramic packages that have cavity structure (available on both top and bottom). Hermetic or vacuum sealing is typically used for them. The ceramic packages are well suited for sensors as ceramics have high rigidity and low thermal expansion. Kyocera provides frit seal ceramic lids and solder seal metal lids, too.
Technical Details on AO700 high strength alumina
Dissipation factor (x10E-4)
CTE (ppm/K) (RT-400° C)
Thermal conductivity (W/mK)
Flexural Strenght (MPa)
Young's Modulus of Elasticity (GPa)