KYOCERA Presents SLC Wiring Boards and IC Packages
High Density Organic Flip chip Substrates
30 April 2010
Kyoto / Neuss, 30 April 2010 - The Japanese technology company KYOCERA - one of the worldwide leading manufacturers of ceramic packages for the microelectronics industry - will present High Density Organic Flip Chip Substrates at the SMT show in Nuremberg from June 8th to June 10th (Hall 9 /Stand 9-241).
For products requiring System in Package (SiP) techniques, Kyocera offers the perfect substrate solution for a wide range of applications including mobile phones, digital cameras and hand held devices. Kyocera can work together with customers to design SiP substrate solutions that meet all product requirements and line and space capabilities of 20µm/20µm in the build-up layers can be realized in high volume production. Multiple assembly techniques such as flip chip and wire bonding patterns can be provided for in the same designs allowing high levels of integration to be achieved. This product line is characterized by Kyocera’s well known high performance, excellent reliability and cost competitiveness. Kyocera's SLC Technology is RoHs compliant and ISO9001/ ISO14001 certified.