KYOCERA DOCUMENT SOLUTIONS WINS WORLDSTAR AWARD FOR ITS DEVELOPMENT OF HIGH-PERFORMANCE MOLDED PULP PACKAGING MATERIALS

17 January 2014

KYOCERA DOCUMENT SOLUTIONS WINS WORLDSTAR AWARD FOR ITS DEVELOPMENT OF HIGH-PERFORMANCE MOLDED PULP PACKAGING MATERIALS

KYOCERA Document Solutions Inc. announced that it has won a WorldStar Packaging Award in a contest hosted by the World Packaging Organisation (WPO) for its “Development of High-Performance Molded Pulp Packaging Materials.” The company has won awards in the contest for six consecutive years with a total of eight awards. The WorldStars hold great prestige internationally and awards are presented only to those companies who have already won recognition in a national or regional competition — KYOCERA Document Solutions’ entry having first won the Logistics Award in the Japan Packaging Contest 2013*.

KYOCERA Document Solutions succeeded in improving the strength of packaging materials for printers substantially by developing a pulp mold consisting of a number of ribbed protrusions having varied shapes and sizes. This compact and high-performance packaging material allows the buffer distance to be reduced by up to 50% compared to conventional packaging. In addition, total box volume and weight of the package have been reduced by about 30% compared to conventional materials, and CO2 emissions per unit have been reduced by 32% based on the EcoLeaf environmental label calculation**.

The company uses recyclable, environmentally friendly materials such as papers and pulp, not petroleum-based polystyrene foam, for its product packaging from small-sized printers all the way to large multifunctional products with weights in the few-hundred-kilogram range. The company also develops and designs all of the packages for its products and invests great effort in reducing the amount of raw materials used in packaging. The company’s technological capability for developing efficient packaging has won high acclaim both in Japan and abroad.

For more information about WPO, please visit:
http://www.worldpackaging.org/i4a/pages/index.cfm?pageid=1#&panel1-1

For more information about WorldStar 2013-2014, please visit:
https://www.iom3online.org/IOM/media/uploaded/EVIOM/event_343/2014%20Electronics%20Winners.pdf

* The Japan Packaging Contest is the largest packaging competition in Japan and it is held every year under the sponsorship of the Japan Packaging Institute with the aim of promoting the development and spread of high-quality packages and packaging techniques around the country.
** The EcoLeaf environmental label was introduced by the Japan Environmental Management Association for Industry (JEMAI) and uses the LCA method to quantitatively show the environmental information of products through life cycle stages from the extraction of resources to manufacturing, assembly, distribution, use, discarding and recycling.



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