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Ultra High Vacuum Components
Thin Film Space Transformers for Wafer Probe Cards
Organic Build-up Printed Boards
Organic Build-up SiP (System in Packages)
Flip Chip BGA (Organic Build-up Substrates)
Flip Chip BGA (Ceramic Substrates)
MEMS Sensor Packages
Image Sensor Packages and Optical Window Lids
Fiber Optic Package and Components
LED (Light Emitting Diode) Single-Chip or MCM Package
Power Electronics Package and Substrates
RF Power LDMOS/FET Packages
Microwave Packages
Millimeter Wave Packages
Thin Film Metallised Ceramic Packages and Substrates
RF Module Substrates (Mobile Phone, WLAN,Bluetooth)
Micro Fine Carriers
SMD Packages for SAW Filter
SMD Packages for Quartz Crystal, MCF, Oscillator, TCXO
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