| KYOCERA Presents SLC Wiring Boards and IC Packages |
| High Density Organic Flip chip Substrates |
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Kyoto / Neuss, 30 April 2010 - The Japanese technology company KYOCERA - one of the worldwide leading manufacturers of ceramic packages for the microelectronics industry - will present High Density Organic Flip Chip Substrates at the SMT show in Nuremberg from June 8th to June 10th (Hall 9 /Stand 9-241).
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| Kyocera Develops Industry’s First SAW Filter with High Selectivity for the Prevention of Radio Wave Interference |
| Separating adjacent signals by 5 MHz-widths in the 2.6 GHz range contributes to stable data communications in WiMAX and other high-speed wireless networks |
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Kyoto/ Neuss — Kyocera Corporation (President: Tetsuo Kuba) announced today that it has successfully developed two types of compact Surface Acoustic Wave (SAW) filters — for reception and transmission — that dramatically improve the prevention of radio wave interference in next-generation high-speed wireless communication networks such as WiMAX. This development creates the first SAW filters in the industry in the high-frequency range of 2.6 GHz to feature high selectivity and low loss characteristics. Samples of the new SAW filters are currently available.
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| KYOCERA to Mass-Produce the World’s Thinnest TCXO |
| High precision, ultra-miniature KT2016 Series for GPS applications |
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Kyoto/ Neuss – Kyocera Corporation announced that it will begin mass production next month of its new KT2016 Series Temperature Compensated Crystal Oscillator (TCXO), which has the world’s lowest profile* and is amongst the world’s smallest TCXO units for GPS applications at a size of 2.0×1.6×0.75(max)mm. Along with its high precision in GPS applications, the new KT2016 Series has achieved an approximately 40 percent reduction in size and volume compared with Kyocera’s conventional KT2520 Series, thereby contributing to mounting area miniaturization.
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| Surface Mount Packages for Electronic Devices |
| Sensor + Test 2008 |
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Kyoto / Neuss8 - Kyocera Fineceramics GmbH will present its packaging solutions for electronic devices at the measurement fair "Sensor + Test" in Nuremberg form May 6 to 8, hall 7, booth 7-364.
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