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Kyocera Announces Innovative Epoxy Molding Compound, High-Thermal-Conductive Silver Sintering Paste and Revolutionary TOROKERU Sheet

The new Kyocera innovations were presented at the PCIM exhibition in Nuremberg from 16 – 18 May in hall 6, stand 301

Kyoto/London - Kyocera Corporation has recently developed a high-thermal-conductivity epoxy molding compound with a thermal conductivity of 6W/mK. This marks a significant increase in the conventional thermal conductivity of 0.9-3W/mK and thus enhances the protection of semiconductor components from light, temperature, humidity, dust and physical shock.

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