Power - AMB Substrates

Benefit from our experience and know how

Kyocera is one of the leading manufacturers of SiN AMB substrates for a wide range of applications. With our longterm experience and market know how we can offer you the best support - from your first idea until the market launch.

High reliability AMB (ActiveMetalBonding) process

  • Ti compound - alloy (Ag-Cu)
  • Brazing Process at 850°C in vacuum
    ⇒ High adhesion strength Cu to ceramics

Features

  • High reliabilty due to AMB technology
  • Various plating options (Ni, NiAu, NiPdAu, direct Ag)
  • High thermal conductivity
  • Multilayer structure feasible
  • Various connector possibilities

Reference markets

 

  • Automotive - TS16949 qualified
     
  • Space - ESA qualified
     
  • Avionics
     
  • Industrial


SiN AMB multilayer
package

Thick copper:
Thickness 4 mm

Connection:
Lead type

Connection:
Pin type
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